Research Scientist or Research Engineer, Semiconductor Process Integration and 3D Technologies at VTT, Espoo, Finland. Role: development and characterization of processes for monolithic and heterogeneous integration for post-CMOS integration; solving complex fabrication challenges; work on CMOS integrated 2D sensors, in-memory analog computing and post-CMOS 3D integration in close collaboration with academic and industrial partners. Requirements: MSc or PhD in physics, electronics or closely similar field; experience in semiconductor process integration and 3D technologies and in cleanroom fabrication; excellent English communication skills. Employment: permanent full-time; research at Micronova, the Finnish micro-, nano- and quantum-technology infrastructure. Application window: 22 October - 15 November 2026. Listed on Academic Positions.
The last date to apply is 15 Nov 2026. Apply a few days early — portals slow down near the deadline.
This role is based in Finland. Check visa and work-permit rules on the official page for your situation.
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